RoHS 当前完整豁免清单 英文原版 part1

tandter

Summary
on
2007-5-17

2002/95/EC 27 January 2003

2005/717/EC 13 October 2005

2005/747/EC 21 October 2005
2006/310/EC 21 April 2006
2006/690/EC12 October 2006
2006/691/EC12 October 2006

2006/692/E 12 October 2006

Applications of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) which are exempted from the requirements of Article 4(1)’;

1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.

2. Mercury in straight fluorescent lamps for general purposes not exceeding:

— halophosphate 10 mg

— triphosphate with normal lifetime 5 mg

— triphosphate with long lifetime 8 mg.

3. Mercury in straight fluorescent lamps for special purposes.

4. Mercury in other lamps not specifically mentioned in this Annex.

5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

6. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.

7. — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
— lead in electronic ceramic parts (e.g. piezoelectronic devices).’;
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use of certain dangerous substances and preparations.

9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.

9a. DecaBDE in polymeric applications;’

9b. Lead in lead-bronze bearing shells and bushes’.

10. Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for:

— Deca BDE,

— mercury in straight fluorescent lamps for special purposes,

— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption), and

— light bulbs,

11. Lead used in compliant pin connector systems.
12. Lead as a coating material for the thermal conduction module c-ring.
13. Lead and cadmium in optical and filter glass.
14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’

16. Lead in linear incandescent lamps with silicate coated tubes.
17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography
applications.
18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun
tanning lamps containing phosphors such as BSP (BaSi2O5b) as well as when used as speciality lamps for
diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors
such as SMS ((Sr,Ba)2MgSi2O7b).
19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary
amalgam in very compact Energy Saving Lamps (ESL).
20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal
Displays (LCD).’

tandter

‘21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass.

22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.

23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead

frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with

copper lead frames.

24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.

25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural

elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode,

the barrier ribs, the seal frit and frit ring as well as in print pastes.

26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.

27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.

28. Hexavalent chromium in corrosion preventive coatings of

unpainted metal sheetings and fasteners used for corrosion

protection and Electromagnetic Interference Shielding in

equipment falling under category three of Directive

2002/96/EC (IT and telecommunications equipment).

Exemption granted until 1 July 2007.’

29. Lead bound in crystal glass as defined in Annex I (Categories

1, 2, 3 and 4) of Council Directive 69/493/EEC (*).

gkyan88

没中文呀,看不懂